Abstract: Wafer bonding is a key technology for achieving heterogeneous integration in the fabrication of microelectronic and optoelectronic devices. Conventional bonding processes rely on high-grade ...
Confined spaces, characterized by limited access and poor ventilation, pose significant safety challenges due to the accumulation of hazardous gases. Flammable, toxic gases and oxygen-deficient ...
Interested investors should contact their Jefferies sales representatives. Management will be conducting one-on-one and group meetings with investors in attendance at the Jefferies conference.
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